Semiconductor packages including recesses to contain solder

ABSTRACT

One example of a semiconductor package includes a first substrate, a second substrate, a semiconductor die, and a spacer. The semiconductor die is attached to the first substrate. The spacer is attached to the semiconductor die and attached to the second substrate via solder. A surface of the second substrate facing the spacer includes a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.

BACKGROUND

Semiconductor packages, such as double sided cooling (DSC) modules, may include components (e.g., semiconductor dies, spacers, bond wires, bond pads, etc.) between two substrates. During the fabrication of such packages, it is necessary to connect components such as semiconductor chips and spacers to both of the two substrates, so soldering may need to take place on the underside of the upper substrate. There is a need therefore to carry out such soldering operations reliably.

For these and other reasons, a need exists for the present disclosure.

SUMMARY

One example of a semiconductor package includes a first substrate, a second substrate, a semiconductor die, and a spacer. The semiconductor die is attached to the first substrate. The spacer is attached to the semiconductor die and attached to the second substrate via solder. A surface of the second substrate facing the spacer includes a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.

Another example of a semiconductor package includes a first direct bonded copper (DBC) substrate, a second DBC substrate, a semiconductor die, and a spacer. The semiconductor die is attached to the first DBC substrate. The spacer is attached to the semiconductor die and attached to the second DBC substrate via solder. A copper layer of the second DBC substrate facing the spacer includes a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.

One example of a method for fabricating a semiconductor package includes attaching a semiconductor die to a first substrate. The method further includes attaching a spacer to the semiconductor die. The method further includes soldering a second substrate to the spacer such that at least one recess in a surface of the second substrate facing the spacer extends from proximate a first edge of the spacer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view illustrating one example of a semiconductor package including recesses to contain solder.

FIGS. 1B-1F are top views illustrating example substrates including recesses to contain solder for use in semiconductor packages.

FIG. 2 is a cross-sectional view illustrating another example of a semiconductor package including recesses to contain solder.

FIGS. 3A and 3B illustrate another example of a semiconductor package.

FIGS. 4A-4C are cross-sectional views illustrating example recesses of different depths in direct bonded copper (DBC) substrates for use in semiconductor packages.

FIG. 5 is a flow diagram illustrating one example of a method for fabricating a semiconductor package.

DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific examples in which the disclosure may be practiced. It is to be understood that other examples may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims. It is to be understood that features of the various examples described herein may be combined, in part or whole, with each other, unless specifically noted otherwise.

Semiconductor packages, such as double sided cooling (DSC) modules, may include components (e.g., semiconductor dies, spacers, bond wires, bond pads, etc.) between two substrates. During fabrication of such semiconductor packages, liquid solder may drop down and/or splash during soldering when the substrates are soldered to the components and/or the components are soldered to the substrates. If the liquid solder drops or splashes onto bond pads or bond wires, there is a risk for electrical shorts.

FIG. 1A is a cross-sectional view illustrating one example of a semiconductor package 100. Semiconductor package 100 includes a first substrate 102, a second substrate 104, a semiconductor die 106, and a spacer 108. One surface 105 (e.g., the bottom surface) of the semiconductor die 106 is attached to a surface 101 (e.g., top surface) of the first substrate 102 (e.g., via an adhesive material or solder). One surface 109 (e.g., the bottom surface) of the spacer 108 is attached to another surface 107 (e.g., the top surface) of the semiconductor die 106. Another surface 111 (e.g., the top surface) of the spacer 108 is attached to one surface 103 (e.g., the bottom surface) of the second substrate 104 via solder 110. The surface 103 (e.g., bottom surface) of the second substrate 104 facing the spacer 108 includes a plurality of recesses 112 a extending from proximate at least one edge 114 and/or 116 of the spacer 108 to contain a portion of the solder 110. The plurality of recesses 112 a as illustrated contain the portion of the solder 110. In other examples, the surface 101 (e.g., top surface) of the first substrate 102 may also include a plurality of recesses (not shown) extending from proximate at least one edge of the semiconductor die 106 to contain a portion of solder between the semiconductor die 106 and the first substrate 102.

By including recesses 112 a in the second substrate 104 and/or in the first substrate 102, liquid solder is prevented from dropping down or splashing during soldering as any excess solder may be contained by the recesses. In addition, recesses 112 a may provide increased adhesion between the second substrate 104 and the spacer 108. The recesses 112 a may also guide any excess solder outside of areas of the semiconductor package 100 where electrical shorts are a risk.

First substrate 102 and second substrate 104 may be copper substrates, aluminum substrates or other suitable substrates. Spacer 108 may be a copper spacer, an aluminum spacer, or another suitable metal spacer. Recesses 112 a partially extend into the second substrate 104, such as up to one half the thickness of the second substrate 104. Each recess includes a depth 113 (as shown in FIG. 1A), a width 118 (as shown in FIG. 1B), and a length 119 (as shown in FIG. 1B), wherein the length is greater than the depth and the width. The width of each recess may be on the order of micrometers to millimeters wide. The length of each recess may be on the order of micrometers to millimeters long.

FIG. 1B is a top view illustrating an example configuration 120 of the second substrate 104 of FIG. 1A. Spacer 108 of FIG. 1A is indicated by dashed lines in FIG. 1B. In this example, a plurality of recesses 112 b extend from proximate each of the four edges 114, 115, 116, and 117 of the spacer 108 and extend perpendicular to each edge 114, 115, 116, and 117 of the spacer 108. In this example, recesses 112 b do not extend between the spacer 108 and the second substrate 104. While four recesses 112 b are illustrated proximate each edge 114, 115, 116, and 117 of the spacer 108 in FIG. 1B, in other examples, less than four recesses or more than four recesses may be arranged proximate each edge 114, 115, 116, and 117 of the spacer 108. In addition, while recesses 112 b are illustrated proximate four edges 114, 115, 116, and 117 of the spacer 108 in FIG. 1B, in other examples, recesses 112 b may be arranged proximate only one edge, two edges, or three edges of the spacer 108. Further, while recesses 112 b are illustrated as rectangular in shape, in other examples, recesses 112 b may have other suitable shapes, such as arc shaped, square shaped, triangular shaped, etc. In other examples, the second substrate 104 may be replaced by the first substrate 102, and the spacer 108 may be replaced by the semiconductor die 106 in FIG. 1B (and in the following FIGS. 1C-1F), such that recesses 112 b extend from proximate at least one edge of the semiconductor die 106 to contain a portion of the solder used to solder the semiconductor die 106 to the first substrate 102.

FIG. 1C is a top view illustrating an example configuration 130 of the second substrate 104 of FIG. 1A. Spacer 108 of FIG. 1A is indicated by dashed lines in FIG. 1C. In this example, recesses 112 c include a first plurality of recesses 112 c extending from proximate the edge 115 of the spacer 108 and a second plurality of recesses 112 c extending from proximate the edge 117 of the spacer 108. Recesses 112 c extend perpendicular to each edge 115 and 117 of the spacer 108. In this example, recesses 112 c extend at least partially between the spacer 108 and the second substrate 104. While four recesses 112 c are illustrated proximate each edge 115 and 117 of the spacer 108 in FIG. 1C, in other examples, less than four recesses or more than four recesses may be arranged proximate each edge 115 and 117 of the spacer 108. In addition, while recesses 112 c are illustrated proximate two edges 115 and 117 of the spacer 108 in FIG. 1B, in other examples, recesses 112 c may be arranged proximate one edge, three edges, or four edges of the spacer 108.

FIG. 1D is a top view illustrating an example configuration 140 of the second substrate 104 of FIG. 1A. Spacer 108 of FIG. 1A is indicated by dashed lines in FIG. 1D. In this example, recesses 112 d include a first plurality of recesses 112 d extending from proximate the edge 115 of the spacer 108, a second plurality of recesses 112 d extending from proximate the edge 116 of the spacer 108, and a third plurality of recesses 112 d extending from proximate the edge 117 of the spacer 108. In this example, recesses 112 d extend between the spacer 108 and the second substrate 104 and intersect such that a grid pattern is formed between the spacer 108 and the second substrate 104. While four recesses 112 d are illustrated proximate each edge 115, 116, and 117 of the spacer 108 in FIG. 1D, in other examples, less than four recesses or more than four recesses may be arranged proximate each edge 115, 116, and 117 of the spacer 108. In addition, while recesses 112 d are illustrated proximate three edges 115, 116, and 117 of the spacer 108 in FIG. 1D, in other examples, recesses 112 d may be arranged proximate one edge, two edges, or four edges of the spacer 108.

FIG. 1E is a top view illustrating an example configuration 150 of the second substrate 104 of FIG. 1A. Spacer 108 of FIG. 1A is indicated by dashed lines in FIG. 1E. In this example, a plurality of recesses 112 e extend radially from the spacer 108, such that a recess 112 e extends from proximate each of the four edges 114, 115, 116, and 117 of the spacer 108 and a recess 112 e extends from proximate each corner of the spacer 108. In this example, recesses 112 e do not extend between the spacer 108 and the second substrate 104. While eight recesses 112 e extending radially from the spacer 108 are illustrated in FIG. 1B, in other examples, less than eight recesses or more than eight recesses may extend radially from the spacer 108. In addition, while recesses 112 e are illustrated proximate four edges 114, 115, 116, and 117 and four corners of the spacer 108 in FIG. 1E, in other examples, recesses 112 e may be arranged proximate only one edge, two edges, or three edges of the spacer 108 and/or proximate only one corner, two corners, or three corners of the spacer 108.

FIG. 1F is a top view illustrating an example configuration 160 of the second substrate 104 of FIG. 1A. Spacer 108 of FIG. 1A is indicated by dashed lines in FIG. 1F. In this example, a plurality of recesses 112 f extend radially from the spacer 108, such that a recess 112 f extends from proximate each of the four edges 114, 115, 116, and 117 of the spacer 108 and a recess 112 f extends from proximate each corner of the spacer 108. In this example, recesses 112 f extend between the spacer 108 and the second substrate 104 and intersect to form a star pattern between the spacer 108 and the second substrate 104. While eight recesses 112 f extending radially from the spacer 108 are illustrated in FIG. 1F, in other examples, less than eight recesses or more than eight recesses may extend radially from the spacer 108. In addition, while recesses 112 f are illustrated proximate four edges 114, 115, 116, and 117 and four corners of the spacer 108 in FIG. 1F, in other examples, recesses 112F may be arranged proximate only one edge, two edges, or three edges of the spacer 108 and/or proximate only one corner, two corners, or three corners of the spacer 108.

FIG. 2 is a cross-sectional view illustrating another example of a semiconductor package 200. Semiconductor package 200 includes a first substrate 202, a second substrate 204, a semiconductor die 206, and a spacer 208. One surface 205 (e.g., the bottom surface) of the semiconductor die 206 is attached to a surface 201 (e.g., top surface) of the first substrate 202 (e.g., via an adhesive material or solder). One surface 209 (e.g., the bottom surface) of the spacer 208 is attached to another surface 207 (e.g., the top surface) of the semiconductor die 206. Another surface 211 (e.g., the top surface) of the spacer 208 is attached to one surface 203 (e.g., the bottom surface) of the second substrate 204 via solder 210. The surface 203 (e.g., bottom surface) of the second substrate 204 facing the spacer 208 includes a plurality of recesses 212 extending from proximate at least one edge 214 of the spacer 208 to contain a portion of the solder 210.

Semiconductor die 206 includes contact pads 220 facing the second substrate 204. Bond wires 222 electrically couple the contact pads 220 to the first substrate 202. The plurality of recesses 212 are arranged to extend over the contact pads 220 and the bond wires 222. Recesses 212 contain a portion (e.g., excess) of the solder 210 such that liquid solder does not drop onto contact pads 220 or bond wires 222 during soldering of the second substrate 204 to the spacer 208. Recesses 212 may be arranged in any suitable configuration, such as any of the example configurations 120, 130, 140, 150, or 160 previously described and illustrated with reference to FIGS. 1B-1F, respectively.

FIGS. 3A and 3B illustrate another example of a semiconductor package 300, such as a double sided cooling package. Semiconductor package 300 includes a first direct bonded copper (DBC) substrate 302, a second DBC substrate 304, a plurality of semiconductor dies (e.g., 306 a and 306 b) attached to the first DBC substrate 302, and a plurality of spacers (e.g., 308 a and 308 b) each attached to a respective semiconductor die and attached to the second DBC substrate via solder. The copper layer of the second DBC substrate 304 facing the spacers includes a plurality of recesses (e.g., as previously described and illustrated with reference to FIGS. 1A-1F) extending from proximate at least one edge of at least one spacer to contain a portion of the solder.

One or more semiconductor dies (e.g., 308 a) may include contact pads (e.g., 320 a) facing the second substrate 304. Bond wires (e.g., 322 a) electrically couple the contact pads to the first substrate 302. The plurality of recesses may be arranged to extend over the contact pads and the bond wires. The recesses contain a portion (e.g., excess) of the solder such that liquid solder does not drop onto the contact pads or bond wires during soldering of the second substrate 304 to the spacers.

FIG. 4A is a cross-sectional view illustrating one example of a substrate 400 a, such as a DBC substrate for use in semiconductor packages (e.g., 100, 200, or 300). Substrate 400 a includes a first metal layer 402 a, a second metal layer 406, and a dielectric layer 404 between the first metal layer 402 a and the second metal layer 406. The first metal layer 402 a and the second metal layer 406 may include copper or another suitable metal. The dielectric layer 404 may include a ceramic material or another suitable dielectric material. A plurality of recesses 412 a are formed in the first metal layer 402 a. The plurality of recesses 412 a may include any suitable configuration, such as a configuration previously described and illustrated with reference to FIGS. 1B-1F. Each recess 412 a extends partially into the first metal layer 402 a toward the dielectric layer 404. For example, each recess 412 a may be micro-etched into the first metal layer 402 a such that each recess has a depth less than one half the thickness of the first metal layer 402 a.

FIG. 4B is a cross-sectional view illustrating another example of a substrate 400 b, such as a DBC substrate for use in semiconductor packages (e.g., 100, 200, or 300). Substrate 400 b includes a first metal layer 402 b, a second metal layer 406, and a dielectric layer 404 between the first metal layer 402 b and the second metal layer 406. A plurality of recesses 412 b are formed in the first metal layer 402 b. The plurality of recesses 412 b may include any suitable configuration, such as a configuration previously described and illustrated with reference to FIGS. 1B-1F. Each recess 412 b extends partially into the first metal layer 402 b toward the dielectric layer 404. For example, each recess 412 b may extend into the first metal layer 402 a to a depth greater than the depth of each recess 412 a of FIG. 4A, such as one half the thickness of first metal layer 402 b.

FIG. 4C is a cross-sectional view illustrating another example of a substrate 400 c, such as a DBC substrate for use in semiconductor packages (e.g., 100, 200, or 300). Substrate 400 c includes a first metal layer 402 c, a second metal layer 406, and a dielectric layer 404 between the first metal layer 402 c and the second metal layer 406. A plurality of recesses 412 c are formed in the first metal layer 402 c. The plurality of recesses 412 c may include any suitable configuration, such as a configuration previously described and illustrated with reference to FIGS. 1B-1F. Each recess 412 c extends completely through the first metal layer 402 c to the dielectric layer 404.

FIG. 5 is a flow diagram illustrating one example of a method 500 for fabricating a semiconductor package, such as semiconductor package 100, 200, or 300 previously described and illustrated with reference to FIGS. 1A-3B. At 502, method 500 includes attaching a semiconductor die (e.g., 106, 206, or 306) to a first substrate (e.g., 102, 202, or 302). At 504, method 500 includes attaching a spacer (e.g., 108, 208, or 308) to the semiconductor die. At 506, method 500 includes soldering a second substrate (e.g., 104, 204, or 304) to the spacer such that at least one recess (e.g., 112 or 212) in a surface of the second substrate facing the spacer extends from proximate a first edge (e.g., 114 or 214) of the spacer. In one example, soldering the second substrate to the spacer may include soldering the second substrate to the spacer such that a plurality of recesses in the surface of the second substrate facing the spacer extend from proximate a plurality of edges of the spacer. During soldering, the solder may flow into the at least one recess. In one example, the second substrate is soldered to the spacer with the second substrate above the spacer (e.g., as shown by the orientations of the semiconductor packages 100, 200, and 300 of FIGS. 1A, 2, and 3B). In another example, the second substrate is soldered to the spacer with the spacer above the second substrate (e.g., with the semiconductor packages 100, 200, and 300 of FIGS. 1A, 2, and 3B flipped vertically).

Although specific examples have been illustrated and described herein, a variety of alternate and/or equivalent implementations may be substituted for the specific examples shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific examples discussed herein. Therefore, it is intended that this disclosure be limited only by the claims and the equivalents thereof. 

1. A semiconductor package comprising: a first substrate; a second substrate; a semiconductor die attached to the first substrate; and a spacer attached to the semiconductor die and attached to the second substrate via solder, wherein a surface of the second substrate facing the spacer comprises a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.
 2. The semiconductor package of claim 1, wherein at least one of the plurality of recesses extends perpendicular to the at least one edge of the spacer.
 3. The semiconductor package of claim 1, wherein at least one of the plurality of recesses extends radially from the spacer.
 4. The semiconductor package of claim 1, wherein the surface of the second substrate facing the spacer comprises a first plurality of recesses extending from proximate a first edge of the spacer and a second plurality of recesses extending from proximate a second edge of the spacer.
 5. The semiconductor package of claim 1, wherein at least one of the plurality of recesses extends at least partially between the spacer and the second substrate.
 6. The semiconductor package of claim 1, wherein the second substrate comprises a first metal layer, a second metal layer, and a dielectric layer between the first metal layer and the second metal layer, the first metal layer facing the spacer, and the plurality of recesses formed in the first metal layer.
 7. The semiconductor package of claim 6, wherein each recess of the plurality of recesses partially extends into the first metal layer toward the dielectric layer.
 8. The semiconductor package of claim 6, wherein each recess of the plurality of recesses extends completely through the first metal layer to the dielectric layer.
 9. The semiconductor package of claim 1, wherein each recess of the plurality of recesses comprises a depth, a width, and a length, wherein the length is greater than the depth and the width.
 10. The semiconductor package of claim 1, wherein the semiconductor die comprises contacts pads facing the second substrate, and wherein the plurality of recesses are arranged to extend over the contact pads.
 11. The semiconductor package of claim 1, wherein a surface of the first substrate facing the semiconductor die comprises a plurality of recesses extending from proximate at least one edge of the semiconductor die.
 12. A semiconductor package comprising: a first direct bonded copper (DBC) substrate; a second DBC substrate; a semiconductor die attached to the first DBC substrate; and a spacer attached to the semiconductor die and attached to the second DBC substrate via solder, wherein a copper layer of the second DBC substrate facing the spacer comprises a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.
 13. The semiconductor package of claim 12, wherein the copper layer of the second DBC substrate facing the spacer comprises a plurality of recesses extending from proximate a plurality of edges of the spacer.
 14. The semiconductor package of claim 12, wherein each recess of the plurality of recesses partially extends into the copper layer of the DBC substrate facing the spacer.
 15. The semiconductor package of claim 12, wherein each recess of the plurality of recesses extends completely through the copper layer of the DBC substrate facing the spacer.
 16. The semiconductor package of claim 12, wherein the semiconductor package comprises a double sided cooling package.
 17. A method for fabricating a semiconductor package, the method comprising: attaching a semiconductor die to a first substrate; attaching a spacer to the semiconductor die; and soldering a second substrate to the spacer such that at least one recess in a surface of the second substrate facing the spacer extends from proximate a first edge of the spacer.
 18. The method of claim 17, wherein during soldering, solder flows into the at least one recess.
 19. The method of claim 17, wherein the second substrate is soldered to the spacer with the second substrate above the spacer.
 20. The method of claim 17, wherein the second substrate is soldered to the spacer with the spacer above the second substrate.
 21. The method of claim 17, wherein soldering the second substrate to the spacer comprises soldering the second substrate to the spacer such that a plurality of recesses in the surface of the second substrate facing the spacer extend from proximate a plurality of edges of the spacer. 